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Submicron flip chip Die Bonder
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Function: Flip chip bonding, dispensing, dipping, high precision pick and place, eutectic, hot pressing bonding
READ MORE pressure curing furnace - PCO31 (1~1.2Mpa)
Wafer lamination hot pressing wafer bonding

Chip adhesive curing Chip bottom filling adhesive curing

Porous silicon filled film and strip bonding

Composite Forming in the Printing Industry
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ABOUT US
Beijing Torch Co., Ltd. (hereinafter referred to as "TORCH???????") is a high-tech enterprise specializing in the research and development, production, and sales of semiconductor equipment. Its products mainly include silver sintering equipment, flip chip eutectic SMT machines, submicron SMT machines, high-precision SMT machines, vacuum eutectic furnaces, vacuum reflow soldering, etc..

Professional Techincal Team
We have an excellent technical team, which can be designed according to custom7*24 Hours Service

We have an excellent technical team, which can be designed according to customers requirements.
ers requirements.
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Check our news to know more about Aluminum Products Co., Ltd.
I'll tell you something about vacuum heat treatment

Type of vacuum heat treatmentVacuum annealing: eliminate and reduce the heterogeneity of tissue, remove internal stress and improve its plasticity.Vacuum tempering: eliminates internal stress during machining.Vacuum quenching :(gas quenching, oil quenching) fast cooling after heating to harden the m

2019-12-28
H5H6.jpg
2019-12-28
I'll tell you something about vacuum heat treatment

Type of vacuum heat treatmentVacuum annealing: eliminate and reduce the heterogeneity of tissue, remove internal stress and improve its plasticity.Vacuum tempering: eliminates internal stress during machining.Vacuum quenching :(gas quenching, oil quenching) fast cooling after heating to harden the m

READ MORE
Solve the problem of 3D chip stack and break the limit of Moore's law

To solve the problem of liquid cooling when 3D chips stack, the defense advanced research projects agency (DARPA), in collaboration with IBM and the Georgia institute of technology, has developed an in-chip/inter-chip enhanced cooling program that USES an insulating dielectric refrigerant (instead o

2019-12-28
no photo
2019-12-28
Solve the problem of 3D chip stack and break the limit of Moore's law

To solve the problem of liquid cooling when 3D chips stack, the defense advanced research projects agency (DARPA), in collaboration with IBM and the Georgia institute of technology, has developed an in-chip/inter-chip enhanced cooling program that USES an insulating dielectric refrigerant (instead o

READ MORE
Technical status and characteristics of high power IGBT chip

This paper respectively from the IGBT chip structure, the structure of the collector area on the back and front MOS structure, the system analyzes the technology present situation and the characteristics of high power IGBT chip, from two aspects of chip welding and the electrode interconnection comp

2019-12-27
no photo
2019-12-27
Technical status and characteristics of high power IGBT chip

This paper respectively from the IGBT chip structure, the structure of the collector area on the back and front MOS structure, the system analyzes the technology present situation and the characteristics of high power IGBT chip, from two aspects of chip welding and the electrode interconnection comp

READ MORE
Five applications of high power semiconductor lasers in industrial fields

With the development of semiconductor chip technology and optical technology, the output power of semiconductor lasers has been continuously improved, the beam quality has been significantly improved, and more applications have been obtained in the industrial field.At present, the output power and b

2019-12-27
no photo
2019-12-27
Five applications of high power semiconductor lasers in industrial fields

With the development of semiconductor chip technology and optical technology, the output power of semiconductor lasers has been continuously improved, the beam quality has been significantly improved, and more applications have been obtained in the industrial field.At present, the output power and b

READ MORE
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Beijing Torch Co., Ltd
A professional electronic assembly equipment and service provider, is a high-tech enterprise engaged in the research and development, production, and sales of semiconductor packaging machines, SMT production equipment and consumables. Like vacuum reflow ovens, die bonder etc. Currently, it has multiple subsidiary companies and provides you with high-quality products at preferential prices.
    • 400-998-9522
    • sales@torch.cc

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? Tel: 400-998-9522 /  +86-137-0131-4315
? Address: No. 7, Lijing Road, Pukou District, Nanjing, Jiangsu, China
? E-mail:sales@torch.cc
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